Aguade no Nsɛm a Wɔaboaboa Ano .
AOI automatic optical inspection equipment na wɔde hu sɛnea sika kɔkɔɔ nhama a ɛwɔ chips a wɔakyekyere so no te ne sɛnea ɛyɛ pɛpɛɛpɛ. Ɛde-resolution 2D/3D cameras ne AI mfonini dwumadie algorithms di dwuma de hu sika kɔkɔɔ nhama nkitahodiɛ ntɛmntɛm na ɛyɛ pɛpɛɛpɛ wɔ chips a wɔakyekyere no so. Etumi hu nneɛma te sɛ welding tebea, gyinabea, ɔsorokɔ, offset, ne sika kɔkɔɔ hama no mu nneɛma afoforo, na ɛkyerɛ anomalies ahorow anaa sintɔ ahorow, te sɛ welding a enye, breakage, offset, ne ɔhaw afoforo. Sɛ wohu na wosiesie ɔhaw ahorow a ɛfa sika kɔkɔɔ nhama a wɔde di dwuma ho ntɛm ara a, ɛboa ma chips a wɔakyekyere no yɛ papa na wotumi de ho to so na ɛtew chips a asɛe no so.
Aoi sika kɔkɔɔ waya bonding .
Product no mu nneɛma .
1.Gold waya bonding nhwehwɛmu .
Hu sɛnea nhama no yɛ nhama (a mpɛn pii no ɛyɛ sika kɔkɔɔ, kɔbere anaa aluminium nhama), a nea ɛka ho ne nhama no sorokɔ, ne tenten, ne gyinabea, ne ntwemu, ne ho a ɛpaapae, ne ho a ɛpaapae, ne kwan tiaa ne sintɔ afoforo ka ho.
2.Solder joint quality analysis .
Hwɛ sɛnea bonding points no yɛ nokware (solder joint a edi kan, solder joint a ɛto so abien), te sɛ offset, cold solder joint, pad contenmination, ne nea ɛkeka ho.
3.3D nsusuwii a wɔsan yɛ no .
Ebinom a ɛkorɔn-End models betumi anya 3D profile susuw sika kɔkɔɔ waya denam multi-angle optical imaging anaasɛ laser scanning.
Product Properties .
AOI mfiri no optical system soronko ne detection algorithm no yɛ deɛ wɔde di dwuma ma ɛkorɔn-ntɛm, a ɛkorɔn-ntenitivity crystal defect detection ne classification.
2D & 3D Optional, 3d susudua z-axis pɛpɛɛpɛ a ɛkɔ soro kodu 8 μm .
UPH: Ɛboro anaasɛ ɛne 5000pcs/h yɛ pɛ .
AOI 2D a wohu .
AOI 3D a wohu .
Nneɛma a Wɔde Yɛ Adwuma .
1 Detached driver IC, ICER a ne ho ntew IC, scratched photosensitive chip, chip a asɛe, a ɛyɛ fĩ a ɛyɛ fĩ a ɛma hann no yɛ mmerɛw.
AOI automatic optical inspection equipment yɛ link titiriw a ɛbɛma wɔatumi de wɔn ho ato bonding nhyehyɛe no so na wɔde di dwuma kɛse wɔ semiconductor back-awiei a wɔde hyɛ mu no su sohwɛ mu. Sɛ wuhia ano aduru a etu mpɔn kɛse a, yɛsrɛ wo kɔ Huizhou Zhongke Advanced Manufacturing Co., Ltd.
Tags a ɛyɛ hyew .: Automatic Optical Inspection Equipment, China afiri a wɔde hwɛ nneɛma a ɛwɔ hɔ ankasa, wɔn a wɔde nneɛma ma, adwumayɛbea .
Mfiridwuma ho nsɛnkyerɛnne .
● Nsiesiei: 0.5μm~5μm (egyina ahwehwɛ nhyehyɛe so) .
● Ahoɔhare a wɔde hu: nnua a wɔde yɛ mfonini pii kosi du du wɔ sekan biara mu (a ɛfa sɛnea wohu ade no kɛse ho) .
● Wire no kɛse a ɛfata: 15μm ~ 100μm (sika kɔkɔɔ hama/kɔbere hama) .
● Nneɛma a wotumi yɛ no mpɛn pii: ±1μm3μm .
Product Specification .
|
Abɔnten so kɛse . |
L1000 * W800 * H1500 mm . |
|
Tumi a wɔde ma . |
2KW, AC220 V . |
|
Muduro |
800kg . |
